Key details of the European semiconductor contract include:
Seven purchase orders totaling approximately €13.9 million, or approximately US$15.0 million;
Two major purchase orders valued at approximately €10.9 million and €1.8 million, respectively;
Initial deposits of approximately €635,000, or approximately US$740,000, already received by the Company;
Deposits expected to be reflected in the Company's upcoming interim financial results;
Approximately 20% of the total contract value, or approximately €2.8 million, or US$3.0 million expected to be recognized in fiscal year 2026;
Remaining portion expected to be recognized in fiscal year 2027, subject to project delivery, customer acceptance and applicable revenue recognition requirements; and
Contract-related announcement furnished on Form 6-K with the U.S. Securities and Exchange Commission.
HUHU provides high-purity process systems and engineering solutions supporting advanced semiconductor manufacturing facilities, with operations across China, the United States, Germany, Singapore and Japan. The Company has established a track record of serving leading memory semiconductor manufacturers and advanced manufacturing customers in China. Internationally, the Company has also received orders from customers that include a global supplier of DRAM and NAND memory solutions.
"While certain customer identities and project details remain subject to confidentiality obligations common within the semiconductor industry, we believe providing additional visibility regarding contract structure, deposits received and expected revenue realization is helpful for investors," said Mr. Yujun Xiao, Chief Executive Officer of HUHUTECH. "This project reflects HUHU's ongoing participation in advanced semiconductor infrastructure projects across multiple international markets."