Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies
Highlights
- Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X
- New Synopsys certified AI-driven digital and analog flows on SF2P accelerate development of high-performance designs
- AI-driven design technology co-optimization collaboration delivers superior PPA results on the SF2P process
- New Synopsys IP, including 224G, UCIe, MIPI and LPDDR6, on SF2P and SF4X speeds time-to-market for next-generation designs and offers a low-risk path to silicon-success
SUNNYVALE, Calif., June 16, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications. The collaboration between the companies is helping mutual customers achieve successful tape-outs of their complex designs using Synopsys' 3DIC Compiler and Samsung's advanced packaging technologies with fast turnaround time. Mutual customers can improve power, performance and area (PPA) with certified EDA flows for SF2P process, and minimize IP integration risk with the high-quality portfolio of IP on Samsung's most advanced process technologies.